DC FieldValueLanguage
dc.contributor.authorBuczek, Nadine-
dc.contributor.authorHanke, Michael-
dc.contributor.authorBuczek, Pawel-
dc.contributor.authorMartin, Dubslaff-
dc.contributor.authorTonkikh, Alexander-
dc.contributor.authorFuhrmann, Bodo-
dc.contributor.authorLeipner, Hartmut-
dc.date.accessioned2022-04-05T13:13:29Z-
dc.date.available2022-04-05T13:13:29Z-
dc.date.issued2022-04-01-
dc.identifier.issn2158-3226en_US
dc.identifier.urihttp://hdl.handle.net/20.500.12738/12873-
dc.description.abstractWe systematically investigate structural parameters, such as shape, size, elastic strain, and relaxations, of metal-assisted etched vertically modulated Si/SiGe superlattice nanowires by using electron microscopy, synchrotron-based x-ray diffraction, and numerical linear elasticity theory. A vertical Si/Ge superlattice with atomically flat interfaces is grown by using molecular beam epitaxy on Si-buffered Si(001) substrates. The lattice constants for Si and Ge are 5.43 and 5.66 Å, respectively, which indicate a lattice mismatch of 4.2%. This results in a strained layer in the boundary between Si and Ge leading to dislocations. These substrates serve as the starting material for nanostructuring the surface by using metal-assisted etching. It is shown that the high quality crystalline structure is preserved in the fabrication process, while the lattice mismatch is partially relieved by dislocation formation. Despite this highly effective relaxation path, dislocations present in the parent superlattice do not vanish upon nanostructuring for wires with diameters of down to at least 80 nm. We relate these observations to the applicability of silicon-based nanowires for high-performance thermoelectric generators.en
dc.language.isoenen_US
dc.publisherAmerican Institute of Physicsen_US
dc.relation.ispartofAIP Advancesen_US
dc.subject.ddc530: Physiken_US
dc.titleElastic behavior of metal-assisted etched Si/SiGe superlattice nanowires containing dislocationsen
dc.typeArticleen_US
tuhh.container.endpage045006-4en_US
tuhh.container.issue4en_US
tuhh.container.startpage045006-1en_US
tuhh.container.volume12en_US
tuhh.oai.showtrueen_US
tuhh.publication.instituteFakultät Technik und Informatiken_US
tuhh.publication.instituteDepartment Informations- und Elektrotechniken_US
tuhh.publisher.doi10.1063/5.0084924-
tuhh.type.opus(wissenschaftlicher) Artikel-
dc.rights.cchttps://creativecommons.org/licenses/by/4.0/en_US
dc.type.casraiJournal Article-
dc.type.diniarticle-
dc.type.driverarticle-
dc.type.statusinfo:eu-repo/semantics/publishedVersionen_US
dcterms.DCMITypeText-
item.creatorGNDBuczek, Nadine-
item.creatorGNDHanke, Michael-
item.creatorGNDBuczek, Pawel-
item.creatorGNDMartin, Dubslaff-
item.creatorGNDTonkikh, Alexander-
item.creatorGNDFuhrmann, Bodo-
item.creatorGNDLeipner, Hartmut-
item.fulltextNo Fulltext-
item.creatorOrcidBuczek, Nadine-
item.creatorOrcidHanke, Michael-
item.creatorOrcidBuczek, Pawel-
item.creatorOrcidMartin, Dubslaff-
item.creatorOrcidTonkikh, Alexander-
item.creatorOrcidFuhrmann, Bodo-
item.creatorOrcidLeipner, Hartmut-
item.grantfulltextnone-
item.cerifentitytypePublications-
item.languageiso639-1en-
item.openairecristypehttp://purl.org/coar/resource_type/c_6501-
item.openairetypeArticle-
crisitem.author.deptDepartment Informations- und Elektrotechnik-
crisitem.author.orcid0000-0002-4169-5123-
crisitem.author.parentorgFakultät Technik und Informatik-
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