DC FieldValueLanguage
dc.contributor.authorUngar, Louis Y.-
dc.contributor.authorJacobson, Neil G.-
dc.contributor.authorMak, T. M.-
dc.contributor.authorSchulz, Peter-
dc.date.accessioned2026-08-07T07:09:56Z-
dc.date.available2026-08-07T07:09:56Z-
dc.date.issued2026-04-20-
dc.identifier.urihttps://hdl.handle.net/20.500.12738/19730-
dc.description.abstractTestability analysis should be performed during the design stage of a new product, because Design for Testability (DFT) can require design changes. If left to a later stage, changes may no longer be economical or feasible. Diagnosability and prognostic health management (prognosability) also require early consideration. With that in mind, we need to understand what information we can use early in design to assist in improving these properties. A Failure Mode Effects Analysis (FMEA), while not intended specifically to be a testability analysis document, can be instrumental because it too should be developed early in the design process. It contains information we can use to improve test, testability, diagnosability and prognostic attributes of the design. For example, a failure mode (FM) that results in no observable effect is undetectable in any test and requires that the design be revised to provide an observable effect. Similarly, if two or more failure modes result in the same effect, diagnosability will be limited so design changes should be made to differentiate the root causes. Additionally, sensors may be required in the design to help calculate remaining useful life for prognosability. Information contained in the FMEA can be supplemented with additional data to generate a document we call a Failure Mode Effects Testability Analysis (FMETA). The FMETA highlights diagnosability factors by adding a column to identify the replaceable unit(s) responsible for the failure. This allows calculation of how many replaceable units could cause the failure mode. Finally, for prognostics, we need to identify imminent (but not yet manifested) failure modes. The FMETA also incorporates a Risk Testability Number (RTN) that indicates the severity of each testability issue in the design. Issues with high RTNs are of higher priority to resolve. The FMETA identifies the parameters that we need to assess the design's testability, diagnosability and prognosability.en
dc.language.isoenen_US
dc.publisherGlobal Eletronics Associationen_US
dc.subjectDesign for Testability (DFT)en_US
dc.subjectFailure Mode Effects Analysis (FMEA)en_US
dc.subjectDiagnosabilityen_US
dc.subjectFailure Mode Effects Testability Analysis (FMETA)en_US
dc.subjectDFT Requirementsen_US
dc.subject.ddc600: Techniken_US
dc.titleFailure Mode Effects Testability Analysis (FMETA) : testability, diagnosability, prognosability from an FMEAen
dc.typeinProceedingsen_US
dc.relation.conferenceApex Expo 2026en_US
dc.description.versionPeerRevieweden_US
tuhh.container.endpage161en_US
tuhh.container.startpage154en_US
tuhh.oai.showtrueen_US
tuhh.publication.instituteFakultät für Elektro-, Medien- und Informationstechniken_US
tuhh.publication.instituteForschungs- und Transferzentrum Future Mobility and Acousticsen_US
tuhh.publisher.urlhttps://shop.electronics.org/ipc-apex/ipc-apex-conference-presentationproceedings/Revision-2026/english-
tuhh.relation.ispartofseriesAdvanced electronic packaging conference 2026 : component - to system-level integration, held during Apex Expo 2026, Anaheim, California, United States, March 16-19, 2026 ; technical paper proceedingsen_US
tuhh.type.opusInProceedings (Aufsatz / Paper einer Konferenz etc.)-
dc.type.casraiConference Paper-
dc.type.dinicontributionToPeriodical-
dc.type.drivercontributionToPeriodical-
dc.type.statusinfo:eu-repo/semantics/publishedVersionen_US
dcterms.DCMITypeText-
local.comment.externalIm Rahmen des Promotionsprogramms CEADS.en_US
item.openairetypeinProceedings-
item.seriesrefAdvanced electronic packaging conference 2026 : component - to system-level integration, held during Apex Expo 2026, Anaheim, California, United States, March 16-19, 2026 ; technical paper proceedings-
item.languageiso639-1en-
item.fulltextNo Fulltext-
item.grantfulltextnone-
item.cerifentitytypePublications-
item.creatorOrcidUngar, Louis Y.-
item.creatorOrcidJacobson, Neil G.-
item.creatorOrcidMak, T. M.-
item.creatorOrcidSchulz, Peter-
item.tuhhseriesidAdvanced electronic packaging conference 2026 : component - to system-level integration, held during Apex Expo 2026, Anaheim, California, United States, March 16-19, 2026 ; technical paper proceedings-
item.creatorGNDUngar, Louis Y.-
item.creatorGNDJacobson, Neil G.-
item.creatorGNDMak, T. M.-
item.creatorGNDSchulz, Peter-
item.openairecristypehttp://purl.org/coar/resource_type/c_5794-
crisitem.author.deptDepartment Informations- und Elektrotechnik (ehemalig, aufgelöst 10.2025)-
crisitem.author.orcid0009-0009-4830-1498-
crisitem.author.parentorgFakultät Technik und Informatik (ehemalig, aufgelöst 10.2025)-
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